JPH0642345Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0642345Y2 JPH0642345Y2 JP1986036662U JP3666286U JPH0642345Y2 JP H0642345 Y2 JPH0642345 Y2 JP H0642345Y2 JP 1986036662 U JP1986036662 U JP 1986036662U JP 3666286 U JP3666286 U JP 3666286U JP H0642345 Y2 JPH0642345 Y2 JP H0642345Y2
- Authority
- JP
- Japan
- Prior art keywords
- pins
- semiconductor package
- case
- pin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 42
- 238000004080 punching Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Connecting Device With Holders (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986036662U JPH0642345Y2 (ja) | 1986-03-12 | 1986-03-12 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986036662U JPH0642345Y2 (ja) | 1986-03-12 | 1986-03-12 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62149848U JPS62149848U (en]) | 1987-09-22 |
JPH0642345Y2 true JPH0642345Y2 (ja) | 1994-11-02 |
Family
ID=30847275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986036662U Expired - Lifetime JPH0642345Y2 (ja) | 1986-03-12 | 1986-03-12 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0642345Y2 (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100338225B1 (ko) * | 1997-10-07 | 2002-05-27 | 다니구찌 이찌로오, 기타오카 다카시 | 반도체장치 |
JP2007036036A (ja) * | 2005-07-28 | 2007-02-08 | Sumitomo Wiring Syst Ltd | 太陽電池モジュール用端子ボックス |
JP5080326B2 (ja) * | 2008-03-18 | 2012-11-21 | 日立オートモティブシステムズ株式会社 | 電子部品の端子接続構造及び電動パワーステアリング装置のコントロールユニット構造並びに電子部品の端子接続方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
JPS5858351U (ja) * | 1981-10-16 | 1983-04-20 | 日本電気株式会社 | 半導体装置 |
JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
JPS6314470U (en]) * | 1986-07-15 | 1988-01-30 |
-
1986
- 1986-03-12 JP JP1986036662U patent/JPH0642345Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62149848U (en]) | 1987-09-22 |
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